Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406887 | Selective film formation using a self-assembled monolayer | Dina H. Triyoso, Lior Huli, Corey Lemley, Robert D. Clark | 2025-09-02 |
| 12400963 | Conductive superlattice structures and methods of forming the same | Hiroaki Niimi, Hiroki Maehara, Einstein Noel Abarra, Naoki Watanabe | 2025-08-26 |
| 12341053 | System for backside deposition of a substrate | Ronald Nasman, Rodney L. Robison, Hoyoung Kang, Daniel Fulford | 2025-06-24 |
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Shihsheng Chang, Ying Trickett, Eric Chih-Fang Liu, Yun Han +5 more | 2025-02-25 |
| 11908728 | System for backside deposition of a substrate | Ronald Nasman, Rodney L. Robison, Hoyoung Kang, Daniel Fulford | 2024-02-20 |
| 11894240 | Semiconductor processing systems with in-situ electrical bias | David Hurley, Ioan Domsa, Ian Colgan, Gerhardus Van Der Linde, Patrick Hughes +6 more | 2024-02-06 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2023-04-04 |
| 11444082 | Semiconductor apparatus having stacked gates and method of manufacture thereof | Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily, Subhadeep Kal | 2022-09-13 |
| 11443953 | Method for forming and using stress-tuned silicon oxide films in semiconductor device patterning | Kandabara Tapily, Anton J. deVilliers | 2022-09-13 |
| 11170992 | Area selective deposition for cap layer formation in advanced contacts | Kandabara Tapily | 2021-11-09 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2021-06-01 |
| 10923392 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Robert D. Clark, Kai-Hung Yu | 2021-02-16 |
| 10847424 | Method for forming a nanowire device | Kandabara Tapily, Jeffrey Smith | 2020-11-24 |
| 10833078 | Semiconductor apparatus having stacked gates and method of manufacture thereof | Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily, Subhadeep Kal | 2020-11-10 |
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Nicholas Joy, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal +2 more | 2020-06-30 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Kaoru Maekawa, Jeffrey Smith, Nicholas Joy, Kai-Hung Yu | 2020-03-03 |
| 10541174 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Robert D. Clark, Kai-Hung Yu | 2020-01-21 |
| 10453681 | Method of selective vertical growth of a dielectric material on a dielectric substrate | Kandabara Tapily, Takashi Matsumoto, Yusaku Kashiwagi | 2019-10-22 |
| 10426001 | Processing system for electromagnetic wave treatment of a substrate at microwave frequencies | Ronald Nasman, Mirko Vukovic, Rodney L. Robison, Robert D. Clark | 2019-09-24 |
| 10410861 | Method of filling retrograde recessed features | Kandabara Tapily | 2019-09-10 |
| 10378105 | Selective deposition with surface treatment | Kai-Hung Yu, Kandabara Tapily, Takahiro Hakamata, Subhadeep Kal | 2019-08-13 |
| 10217670 | Wrap-around contact integration scheme | Kandabara Tapily, Satoru Nakamura, Soo Doo Chae, Akiteru Ko, Kaoru Maekawa | 2019-02-26 |
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Manabu Oie, Kaoru Maekawa, Cory Wajda, Yuuki Kikuchi +2 more | 2018-12-18 |
| 10068764 | Selective metal oxide deposition using a self-assembled monolayer surface pretreatment | Kandabara Tapily, Cory Wajda, Hoyoung Kang | 2018-09-04 |
| 10056328 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Cory Wajda, Tadahiro Ishizaka, Takahiro Hakamata | 2018-08-21 |