Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406887 | Selective film formation using a self-assembled monolayer | Lior Huli, Corey Lemley, Robert D. Clark, Gerrit J. Leusink | 2025-09-02 |
| 12211907 | Semiconductor manufacturing platform with in-situ electrical bias and methods thereof | Robert D. Clark, David Hurley, Ian Colgan | 2025-01-28 |
| 11915973 | Self-assembled monolayers as sacrificial capping layers | Ainhoa Romo Negreira, Yumiko Kawana | 2024-02-27 |
| 11894240 | Semiconductor processing systems with in-situ electrical bias | David Hurley, Ioan Domsa, Ian Colgan, Gerhardus Van Der Linde, Patrick Hughes +6 more | 2024-02-06 |
| 11882776 | In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cells | Katie Lutker-Lee, Angelique Raley | 2024-01-23 |
| 10236343 | Strain retention semiconductor member for channel SiGe layer of pFET | Timothy J. McArdle, Judson R. Holt, Amy L. Child, George R. Mulfinger | 2019-03-19 |
| 10109492 | Method of forming a high quality interfacial layer for a semiconductor device by performing a low temperature ALD process | Gabriela Dilliway, Elke Erben, Rimoon Agaiby | 2018-10-23 |
| 10050119 | Method for late differential SOI thinning for improved FDSOI performance and HCI optimization | George R. Mulfinger, Ryan Sporer | 2018-08-14 |
| 9917016 | Integrated circuits and methods of forming the same with effective dummy gate cap removal | Klaus Hempel | 2018-03-13 |
| 9583557 | Integrated circuits including a MIMCAP device and methods of forming the same for long and controllable reliability lifetime | Lili Cheng, Jeasung Park, David Paul Brunco, Robert J. Fox, Sanford Chu | 2017-02-28 |
| 9530833 | Semiconductor structure including capacitors having different capacitor dielectrics and method for the formation thereof | Sanford Chu, Johannes Mueller, Patrick Polakowski | 2016-12-27 |
| 9466661 | Method of fabricating a MIM capacitor with minimal voltage coefficient and a decoupling MIM capacitor and analog/RF MIM capacitor on the same chip with high-K dielectrics | Shao-fu Sanford Chu, Bo Yu | 2016-10-11 |
| 9362284 | Threshold voltage control for mixed-type non-planar semiconductor devices | Mitsuhiro Togo, Changyong Xiao, Yiqun Liu, Rohit Pal | 2016-06-07 |
| 9318315 | Complex circuit element and capacitor utilizing CMOS compatible antiferroelectric high-k materials | Johannes Mueller, Mark Nolan, Wenke Weinreich, Konrad Seidel, Patrick Polakowski | 2016-04-19 |
| 9269785 | Semiconductor device with ferroelectric hafnium oxide and method for forming semiconductor device | Johannes Mueller, Robert Binder, Joachim Metzger, Patrick Polakowski | 2016-02-23 |
| 9209186 | Threshold voltage control for mixed-type non-planar semiconductor devices | Mitsuhiro Togo, Changyong Xiao, Yiqun Liu, Rohit Pal | 2015-12-08 |
| 8791003 | Methods for fabricating integrated circuits with fluorine passivation | Elke Erben, Robert Binder | 2014-07-29 |
| 8716149 | Methods for fabricating integrated circuits having improved spacers | Fabian Koehler, Sergej Mutas, Itasham Hussain | 2014-05-06 |
| 8652890 | Methods for fabricating integrated circuits with narrow, metal filled openings | Sven Schmidbauer, Elke Erben, Hao Zhang, Robert Binder | 2014-02-18 |
| 8420519 | Methods for fabricating integrated circuits with controlled P-channel threshold voltage | Elke Erben, Klaus Hempel | 2013-04-16 |
| 8404594 | Reverse ALD | Olubunmi O. Adetutu | 2013-03-26 |
| 8383473 | Methods of forming replacement gate structures for semiconductor devices | Hao Zhang | 2013-02-26 |
| 8039386 | Method for forming a through silicon via (TSV) | Thuy B. Dao, Ross E. Noble | 2011-10-18 |
| 8030220 | Plasma treatment of a semiconductor surface for enhanced nucleation of a metal-containing layer | Olubunmi O. Adetutu | 2011-10-04 |
| 7911002 | Semiconductor device with selectively modulated gate work function | Voon-Yew Thean, Marc Rossow, Gregory S. Spencer, Tab A. Stephens, Victor H. Vartanian | 2011-03-22 |