| 10230458 |
Optical die test interface with separate voltages for adjacent electrodes |
Michael B. McShane, Perry H. Pelley |
2019-03-12 |
$43,088,000 |
| 9810843 |
Optical backplane mirror |
Perry H. Pelley, Michael B. McShane |
2017-11-07 |
$6,995,000 |
| 9766409 |
Optical redundancy |
Perry H. Pelley, Michael B. McShane |
2017-09-19 |
$19,346,000 |
| 9435952 |
Integration of a MEMS beam with optical waveguide and deflection in two dimensions |
Perry H. Pelley, Michael B. McShane |
2016-09-06 |
|
| 9431380 |
Microelectronic assembly having a heat spreader for a plurality of die |
Michael B. McShane, Perry H. Pelley |
2016-08-30 |
|
| 9318451 |
Wirebond recess for stacked die |
Tim V. Pham, Michael B. McShane, Perry H. Pelley |
2016-04-19 |
|
| 9261556 |
Optical wafer and die probe testing |
Michael B. McShane, Perry H. Pelley |
2016-02-16 |
|
| 9099475 |
Techniques for reducing inductance in through-die vias of an electronic assembly |
Michael B. McShane, Kevin J. Hess, Perry H. Pelley |
2015-08-04 |
$5,976,000 |
| 9093429 |
Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices |
Michael B. McShane, Kevin J. Hess, Perry H. Pelley |
2015-07-28 |
$3,725,000 |
| 9094135 |
Die stack with optical TSVs |
Perry H. Pelley, Michael B. McShane |
2015-07-28 |
$3,725,000 |
| 9091820 |
Communication system die stack |
Perry H. Pelley, Michael B. McShane |
2015-07-28 |
$3,725,000 |
| 9082757 |
Stacked semiconductor devices |
Perry H. Pelley, Kevin J. Hess, Michael B. McShane |
2015-07-14 |
$8,596,000 |
| 9070653 |
Microelectronic assembly having a heat spreader for a plurality of die |
Michael B. McShane, Perry H. Pelley |
2015-06-30 |
$10,671,000 |
| 8980734 |
Gate security feature |
Perry H. Pelley, Michael B. McShane, Paul A. Grudowski |
2015-03-17 |
$13,257,000 |
| 8796855 |
Semiconductor devices with nonconductive vias |
Perry H. Pelley, Michael B. McShane |
2014-08-05 |
$8,512,000 |
| 8680674 |
Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices |
Michael B. McShane, Kevin J. Hess, Perry H. Pelley |
2014-03-25 |
$6,861,000 |
| 8258035 |
Method to improve source/drain parasitics in vertical devices |
Leo Mathew, John J. Hackenberg, David C. Sing, Daniel G. Tekleab, Vishal P. Trivedi |
2012-09-04 |
$4,390,000 |
| 8039389 |
Semiconductor device having an organic anti-reflective coating (ARC) and method therefor |
Douglas M. Reber, Mark D. Hall, Kurt H. Junker, Kyle Patterson, Edward K. Theiss +2 more |
2011-10-18 |
$2,434,000 |
| 7910482 |
Method of forming a finFET and structure |
Leo Mathew, Lakshmanna Vishnubholta, Bruce E. White |
2011-03-22 |
|
| 7911002 |
Semiconductor device with selectively modulated gate work function |
Voon-Yew Thean, Marc Rossow, Gregory S. Spencer, Dina H. Triyoso, Victor H. Vartanian |
2011-03-22 |
|
| 7829447 |
Semiconductor structure pattern formation |
Leo Mathew, Rode R. Mora, Tien Ying Luo |
2010-11-09 |
|
| 7745298 |
Method of forming a via |
Olubunmi O. Adetutu, Paul A. Grudowski, Matthew T. Herrick |
2010-06-29 |
|
| 7659156 |
Method to selectively modulate gate work function through selective Ge condensation and high-K dielectric layer |
Voon-Yew Thean, Marc Rossow, Gregory S. Spencer, Dina H. Triyoso, Victor H. Vartanian |
2010-02-09 |
|
| 7566623 |
Electronic device including a semiconductor fin having a plurality of gate electrodes and a process for forming the electronic device |
Leo Mathew, Brian J. Goolsby |
2009-07-28 |
|
| 7504302 |
Process of forming a non-volatile memory cell including a capacitor structure |
Leo Mathew, Ramachandran Muralidhar |
2009-03-17 |
|
