Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12197428 | Corrective notification to account for delay or error in updating digital rules applied to produce resources | Gregory T. Kavounas, Pascal Patrice Van Dooren, Barnabas Kendall | 2025-01-14 |
| 11874826 | Corrective notification to account for delay or error in updating digital rules applied to produce resources | Gregory T. Kavounas, Pascal Patrice Van Dooren, Barnabas Kendall | 2024-01-16 |
| 11315433 | Systems and methods for providing a terrain and runway alerting service over a secured data link | Scott R. Gremmert | 2022-04-26 |
| 10435151 | System for converting a safeguarded free flight onboard battery-powered drone to a ground-powered tethered drone | — | 2019-10-08 |
| 9446858 | Apparatus and methods for tethered aerial platform and system | — | 2016-09-20 |
| 9331046 | Integrated circuit package with voltage distributor | Chu-Chung Lee, Kian Leong Chin, James P. Johnston, Tu-Anh N. Tran, Heng Keong Yip | 2016-05-03 |
| 9331050 | Localized alloying for improved bond reliability | Chu-Chung Lee | 2016-05-03 |
| 9099475 | Techniques for reducing inductance in through-die vias of an electronic assembly | Michael B. McShane, Perry H. Pelley, Tab A. Stephens | 2015-08-04 |
| 9093429 | Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices | Michael B. McShane, Perry H. Pelley, Tab A. Stephens | 2015-07-28 |
| 9082757 | Stacked semiconductor devices | Perry H. Pelley, Michael B. McShane, Tab A. Stephens | 2015-07-14 |
| 9076664 | Stacked semiconductor die with continuous conductive vias | Perry H. Pelley, Michael B. McShane | 2015-07-07 |
| 8912667 | Packaged integrated circuit using wire bonds | Robert J. Wenzel, Chu-Chung Lee | 2014-12-16 |
| 8796822 | Stacked semiconductor devices | Perry H. Pelley, Michael B. McShane | 2014-08-05 |
| 8791582 | Integrated circuit package with voltage distributor | Chu-Chung Lee, Kian Leong Chin, Patrick Johnston, Tu-Anh N. Tran, Heng Keong Yip | 2014-07-29 |
| 8680674 | Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices | Michael B. McShane, Perry H. Pelley, Tab A. Stephens | 2014-03-25 |
| 8501539 | Semiconductor device package | Michael B. McShane | 2013-08-06 |
| 8368172 | Fused buss for plating features on a semiconductor die | George R. Leal, Trent S. Uehling | 2013-02-05 |
| 8349666 | Fused buss for plating features on a semiconductor die | George R. Leal, Trent S. Uehling | 2013-01-08 |
| 8318549 | Molded semiconductor package having a filler material | Chu-Chung Lee | 2012-11-27 |
| 8274146 | High frequency interconnect pad structure | Michael A. Stockinger, James W. Miller | 2012-09-25 |
| 8129226 | Power lead-on-chip ball grid array package | James P. Johnston, Chu-Chung Lee, Tu-Anh N. Tran, James W. Miller | 2012-03-06 |
| 8105933 | Localized alloying for improved bond reliability | Chu-Chung Lee | 2012-01-31 |
| 7857137 | Wound care kit | Michael E. Law | 2010-12-28 |
| 7829997 | Interconnect for chip level power distribution | Chu-Chung Lee, James W. Miller | 2010-11-09 |
| 7821104 | Package device having crack arrest feature and method of forming | Chu-Chung Lee, Min Ding, Peng Su | 2010-10-26 |