Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7750465 | Packaged integrated circuit | Chu-Chung Lee | 2010-07-06 |
| 7656045 | Cap layer for an aluminum copper bond pad | Chu-Chung Lee | 2010-02-02 |
| 7632715 | Method of packaging semiconductor devices | Chu-Chung Lee, Robert J. Wenzel | 2009-12-15 |
| 7626276 | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Susan H. Downey, James W. Miller, Cheng Choi Yong | 2009-12-01 |
| 7572680 | Packaged integrated circuit with enhanced thermal dissipation | Chu-Chung Lee | 2009-08-11 |
| 7550318 | Interconnect for improved die to substrate electrical coupling | Chu-Chung Lee, James W. Miller | 2009-06-23 |
| 7374971 | Semiconductor die edge reconditioning | Yuan Yuan, Chu-Chung Lee, Tu-Anh N. Tran, Alan H. Woosley | 2008-05-20 |
| 7355289 | Packaged integrated circuit with enhanced thermal dissipation | Chu-Chung Lee | 2008-04-08 |
| 7276435 | Die level metal density gradient for improved flip chip package reliability | Scott K. Pozder, Ruiqi Tian, Edward O. Travis, Trent S. Uehling, Brett P. Wilkerson +1 more | 2007-10-02 |
| 7247552 | Integrated circuit having structural support for a flip-chip interconnect pad and method therefor | Scott K. Pozder, Pak K. Leung, Edward O. Travis, Brett P. Wilkerson, David G. Wontor +1 more | 2007-07-24 |
| 7241636 | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Susan H. Downey, James W. Miller, Cheng Choi Yong | 2007-07-10 |
| 7129566 | Scribe street structure for backend interconnect semiconductor wafer integration | Trent S. Uehling | 2006-10-31 |
| 6933614 | Integrated circuit die having a copper contact and method therefor | Chu-Chung Lee, Fuaida Harun, Lan Chu Tan, Cheng Choi Yong | 2005-08-23 |
| 6921979 | Semiconductor device having a bond pad and method therefor | Susan H. Downey, Peter R. Harper, Michael V. Leoni, Tu-Anh N. Tran | 2005-07-26 |