Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7795712 | Lead frame with non-conductive connective bar | Alvin Wee Beng Tatt, Soon Hock Tong, Robert-Christian Hagen, Yang Hong Heng, Kean Cheong Lee | 2010-09-14 |
| 7261230 | Wirebonding insulated wire and capillary therefor | Chiaw Mong Chan, Lan Chu Tan, Lau Teck Beng, Kong Bee Tiu, Soo San Yong | 2007-08-28 |
| 7042098 | Bonding pad for a packaged integrated circuit | Liang Koh, Lan Chu Tan | 2006-05-09 |
| 6933614 | Integrated circuit die having a copper contact and method therefor | Chu-Chung Lee, Kevin J. Hess, Lan Chu Tan, Cheng Choi Yong | 2005-08-23 |
| 6854637 | Wirebonding insulated wire | Kong Bee Tiu | 2005-02-15 |
| 6693020 | Method of preparing copper metallization die for wirebonding | Kok Mui, Lan Chu Tan, Mohd Faizairi Bin Mohd Nor | 2004-02-17 |
| 6563226 | Bonding pad | Lan Chu Tan | 2003-05-13 |