LB

Lau Teck Beng

FS Freeescale Semiconductor: 2 patents #1,335 of 3,767Top 40%
Overall (All Time): #2,036,179 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9134193 Stacked die sensor package Chee Seng Foong, Sheng Ping Took 2015-09-15
7261230 Wirebonding insulated wire and capillary therefor Fuaida Harun, Chiaw Mong Chan, Lan Chu Tan, Kong Bee Tiu, Soo San Yong 2007-08-28