Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581241 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures | Boon Yew Low, Fernando A. Santos, Li Li, Fui Yee Lim | 2023-02-14 |
| 11056457 | Semiconductor device with bond wire reinforcement structure | Boon Yew Low, Wai Yew Lo, Poh Leng Eu, Chin Teck Siong | 2021-07-06 |
| 9997445 | Substrate interconnections for packaged semiconductor device | Kai Yun Yow, Chee Seng Foong, Bihua He, Navas Khan Oratti Kalandar, Yuan Zang | 2018-06-12 |
| 9721928 | Integrated circuit package having two substrates | Navas Khan Oratti Kalandar, Chetan Verma | 2017-08-01 |
| 9589928 | Combined QFN and QFP semiconductor package | Zhigang Bai, Jinzhong Yao | 2017-03-07 |
| 9474162 | Circuit substrate and method of manufacturing same | Chee Seng Foong | 2016-10-18 |
| 9437492 | Substrate for alternative semiconductor die configurations | Kai Yun Yow, Chee Seng Foong | 2016-09-06 |
| 9401345 | Semiconductor device package with organic interposer | Chee Seng Foong, Navas Khan Oratti Kalandar | 2016-07-26 |
| 9297713 | Pressure sensor device with through silicon via | Wai Yew Lo | 2016-03-29 |
| 9269659 | Interposer with overmolded vias | Chee Seng Foong | 2016-02-23 |
| 9214402 | Pressure sensor device with gel retainer | Kee Cheong Fam, Mohd Rusli Ibrahim | 2015-12-15 |
| 9202770 | Non-homogeneous molding of packaged semiconductor devices | Chee Seng Foong | 2015-12-01 |
| 9177834 | Power bar design for lead frame-based packages | Chee Seng Foong, Meng Kong Lye, Seng Kiong Teng | 2015-11-03 |
| 9165904 | Insulated wire bonding with EFO before second bond | Chin Teck Siong, Zi Song Poh | 2015-10-20 |
| 9053972 | Pillar bump formed using spot-laser | Chee Seng Foong | 2015-06-09 |
| 8853058 | Method of making surface mount stacked semiconductor devices | Kesvakumar V. C. Muniandy, Navas Khan Oratti Kalandar | 2014-10-07 |
| 8802474 | Pressure sensor and method of packaging same | Jinzhong Yao, Wai Yew Lo, Xuesong Xu | 2014-08-12 |
| 8716846 | Pressure sensor and method of packaging same | Jinzhong Yao, Wai Yew Lo, Xuesong Xu | 2014-05-06 |
| 8669140 | Method of forming stacked die package using redistributed chip packaging | Kesvakumar V. C. Muniandy, Navas Khan Oratti Kalandar | 2014-03-11 |
| 8643189 | Packaged semiconductor die with power rail pads | Boon Yew Low, Navas Khan Oratti Kalandar | 2014-02-04 |
| 8378435 | Pressure sensor and method of assembling same | Wai Yew Lo | 2013-02-19 |
| 7985672 | Solder ball attachment ring and method of use | Poh Leng Eu, Cheng Qiang Cui | 2011-07-26 |
| 7741196 | Semiconductor wafer with improved crack protection | Heng Keong Yip, Wai Yew Lo | 2010-06-22 |
| 7494924 | Method for forming reinforced interconnects on a substrate | Hei Ming Shiu, On Lok Chau, Gor Lai, Heng Keong Yip, Thoon Khin Chang | 2009-02-24 |
| 7384819 | Method of forming stackable package | Heng Keong Yip | 2008-06-10 |