Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990394 | Semiconductor package and a method for manufacturing of a semiconductor package | Kim Chai Ng, Wai Keung Ho, Raymond Wong | 2024-05-21 |
| 11631634 | Leadless semiconductor package and method of manufacture | Fei Ying Wong, Ringo Cheung, Billie Bi | 2023-04-18 |
| 10269751 | Leadless package with non-collapsible bump | Wai Wong Chow | 2019-04-23 |
| 7494924 | Method for forming reinforced interconnects on a substrate | Hei Ming Shiu, Gor Lai, Heng Keong Yip, Thoon Khin Chang, Lan Chu Tan | 2009-02-24 |
| 7422973 | Method for forming multi-layer bumps on a substrate | Hei Ming Shiu, Gor Lai | 2008-09-09 |
| 7279409 | Method for forming multi-layer bumps on a substrate | Hei Ming Shiu, Gor Lai | 2007-10-09 |
| 7262494 | Three-dimensional package | Hei Ming Shiu, Fei Ying Wong | 2007-08-28 |