Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7566648 | Method of making solder pad | Heng Keong Yip, Chee Seng Foong | 2009-07-28 |
| 7494924 | Method for forming reinforced interconnects on a substrate | Hei Ming Shiu, On Lok Chau, Gor Lai, Heng Keong Yip, Lan Chu Tan | 2009-02-24 |