Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11329030 | Production of a chip module | — | 2022-05-10 |
| 9331046 | Integrated circuit package with voltage distributor | Chu-Chung Lee, Kian Leong Chin, Kevin J. Hess, James P. Johnston, Tu-Anh N. Tran | 2016-05-03 |
| 8791582 | Integrated circuit package with voltage distributor | Chu-Chung Lee, Kian Leong Chin, Kevin J. Hess, Patrick Johnston, Tu-Anh N. Tran | 2014-07-29 |
| 8643172 | Heat spreader for center gate molding | Chee Seng Foong, Aminuddin Ismail | 2014-02-04 |
| 7955953 | Method of forming stacked die package | Wai Yew Lo | 2011-06-07 |
| 7741196 | Semiconductor wafer with improved crack protection | Wai Yew Lo, Lan Chu Tan | 2010-06-22 |
| 7566648 | Method of making solder pad | Thoon Khin Chang, Chee Seng Foong | 2009-07-28 |
| 7531383 | Array quad flat no-lead package and method of forming same | Wai Yew Lo | 2009-05-12 |
| 7494924 | Method for forming reinforced interconnects on a substrate | Hei Ming Shiu, On Lok Chau, Gor Lai, Thoon Khin Chang, Lan Chu Tan | 2009-02-24 |
| 7473586 | Method of forming flip-chip bump carrier type package | Wai Yew Lo | 2009-01-06 |
| 7384819 | Method of forming stackable package | Lan Chu Tan | 2008-06-10 |
| 7282395 | Method of making exposed pad ball grid array package | — | 2007-10-16 |
| 5326453 | Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy | Duane W. Endicott, Michael D. Gernon | 1994-07-05 |