Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8643172 | Heat spreader for center gate molding | Chee Seng Foong, Heng Keong Yip | 2014-02-04 |
| 7554185 | Flip chip and wire bond semiconductor package | Chee Seng Foong, Wai Yew Lo, Bee Hoon Liau, Jin- Mei Liu, Jian Wang +2 more | 2009-06-30 |
| 7432130 | Method of packaging semiconductor die without lead frame or substrate | Chee Seng Foong, Ruzaini B. Ibrahim | 2008-10-07 |