Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7554185 | Flip chip and wire bond semiconductor package | Chee Seng Foong, Aminuddin Ismail, Wai Yew Lo, Bee Hoon Liau, Jian Wang +2 more | 2009-06-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7554185 | Flip chip and wire bond semiconductor package | Chee Seng Foong, Aminuddin Ismail, Wai Yew Lo, Bee Hoon Liau, Jian Wang +2 more | 2009-06-30 |