Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056457 | Semiconductor device with bond wire reinforcement structure | Boon Yew Low, Lan Chu Tan, Poh Leng Eu, Chin Teck Siong | 2021-07-06 |
| 9698093 | Universal BGA substrate | Chee Seng Foong, Ly Hoon Khoo, Wen Shi Koh, Zi Song Poh, Kai Yun Yow | 2017-07-04 |
| 9638596 | Cavity-down pressure sensor device | — | 2017-05-02 |
| 9362479 | Package-in-package semiconductor sensor device | — | 2016-06-07 |
| 9297713 | Pressure sensor device with through silicon via | Lan Chu Tan | 2016-03-29 |
| 9209120 | Semiconductor package with lead mounted power bar | Kong Bee Tiu, Chee Seng Foong | 2015-12-08 |
| 9190352 | Multi-die sensor device | Kong Bee Tiu, Teck Beng Lau | 2015-11-17 |
| 9105469 | Defect mitigation structures for semiconductor devices | Zubin Patel, Tracy Helen Fung, Jinsong Tang, Arun Ramamoorthy | 2015-08-11 |
| 9029999 | Semiconductor sensor device with footed lid | — | 2015-05-12 |
| 8981541 | Quad flat semiconductor device with additional contacts | Kong Bee Tiu, Ruzaini B. Ibrahim | 2015-03-17 |
| 8941194 | Pressure sensor device having bump chip carrier (BCC) | Fui Yee Lim | 2015-01-27 |
| 8809078 | Solar powered IC chip | Teck Beng Lau, Boon Yew Low, Chin Teck Siong | 2014-08-19 |
| 8802474 | Pressure sensor and method of packaging same | Jinzhong Yao, Lan Chu Tan, Xuesong Xu | 2014-08-12 |
| 8778704 | Solar powered IC chip | Teck Beng Lau, Chin Teck Siong | 2014-07-15 |
| 8716846 | Pressure sensor and method of packaging same | Jinzhong Yao, Lan Chu Tan, Xuesong Xu | 2014-05-06 |
| 8546169 | Pressure sensor device and method of assembling same | Fui Yee Lim | 2013-10-01 |
| 8460972 | Method of forming semiconductor package | — | 2013-06-11 |
| 8378435 | Pressure sensor and method of assembling same | Lan Chu Tan | 2013-02-19 |
| 8283780 | Surface mount semiconductor device | Ly Hoon Khoo, Wen Shi Koh | 2012-10-09 |
| 7955953 | Method of forming stacked die package | Heng Keong Yip | 2011-06-07 |
| 7886609 | Pressure sensor package | Boon Seong Lee, Kar Yoke Ong | 2011-02-15 |
| 7745260 | Method of forming semiconductor package | — | 2010-06-29 |
| 7741196 | Semiconductor wafer with improved crack protection | Heng Keong Yip, Lan Chu Tan | 2010-06-22 |
| 7554185 | Flip chip and wire bond semiconductor package | Chee Seng Foong, Aminuddin Ismail, Bee Hoon Liau, Jin- Mei Liu, Jian Wang +2 more | 2009-06-30 |
| 7531383 | Array quad flat no-lead package and method of forming same | Heng Keong Yip | 2009-05-12 |