Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7473586 | Method of forming flip-chip bump carrier type package | Heng Keong Yip | 2009-01-06 |
| 7452750 | Capacitor attachment method | Chee Seng Foong | 2008-11-18 |
| 7378298 | Method of making stacked die package | — | 2008-05-27 |
| 7211466 | Stacked die semiconductor device | Azhar Aripin, Kong Bee Tiu | 2007-05-01 |
| 7160755 | Method of forming a substrateless semiconductor package | Cheng Choi Yong, Kong Bee Tiu | 2007-01-09 |
| 6885093 | Stacked die semiconductor device | Azhar Aripin, Kong Bee Tiu | 2005-04-26 |