Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11633714 | Preparation method for combined modified straw active particulate carbon adsorption material and use of same | Enhui SUN, Hongying Huang, Hongmei Jin, Guofeng Wu, Zhizhou Chang +2 more | 2023-04-25 |
| 9337167 | Wire bonding method employing two scrub settings | Boh Kid Wong | 2016-05-10 |
| 7626276 | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Kevin J. Hess, Susan H. Downey, James W. Miller | 2009-12-01 |
| 7241636 | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Kevin J. Hess, Susan H. Downey, James W. Miller | 2007-07-10 |
| 7160755 | Method of forming a substrateless semiconductor package | Wai Yew Lo, Kong Bee Tiu | 2007-01-09 |
| 6933614 | Integrated circuit die having a copper contact and method therefor | Chu-Chung Lee, Fuaida Harun, Kevin J. Hess, Lan Chu Tan | 2005-08-23 |