Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9305898 | Semiconductor device with combined power and ground ring structure | Ruzaini B. Ibrahim, Wen Shi Koh | 2016-04-05 |
| 9209120 | Semiconductor package with lead mounted power bar | Chee Seng Foong, Wai Yew Lo | 2015-12-08 |
| 9190352 | Multi-die sensor device | Teck Beng Lau, Wai Yew Lo | 2015-11-17 |
| 8981541 | Quad flat semiconductor device with additional contacts | Ruzaini B. Ibrahim, Wai Yew Lo | 2015-03-17 |
| 7261230 | Wirebonding insulated wire and capillary therefor | Fuaida Harun, Chiaw Mong Chan, Lan Chu Tan, Lau Teck Beng, Soo San Yong | 2007-08-28 |
| 7211466 | Stacked die semiconductor device | Wai Yew Lo, Azhar Aripin | 2007-05-01 |
| 7160755 | Method of forming a substrateless semiconductor package | Wai Yew Lo, Cheng Choi Yong | 2007-01-09 |
| 6885093 | Stacked die semiconductor device | Wai Yew Lo, Azhar Aripin | 2005-04-26 |
| 6854637 | Wirebonding insulated wire | Fuaida Harun | 2005-02-15 |