Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10654709 | Shielded semiconductor device and lead frame therefor | Lee Fee Ngion, Michael B. Vincent | 2020-05-19 |
| 9698093 | Universal BGA substrate | Chee Seng Foong, Ly Hoon Khoo, Wen Shi Koh, Wai Yew Lo, Kai Yun Yow | 2017-07-04 |
| 9209144 | Substrate with electrically isolated bond pads | Lee Fee Ngion | 2015-12-08 |
| 9209147 | Method of forming pillar bump | Chee Seng Foong, Lee Fee Ngion, Navas Khan Oratti Kalandar | 2015-12-08 |
| 9165904 | Insulated wire bonding with EFO before second bond | Chin Teck Siong, Lan Chu Tan | 2015-10-20 |
| 8450841 | Bonded wire semiconductor device | Li Ting Celina Ong, Yin Kheng Au | 2013-05-28 |