Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10654709 | Shielded semiconductor device and lead frame therefor | Zi Song Poh, Michael B. Vincent | 2020-05-19 |
| 9209144 | Substrate with electrically isolated bond pads | Zi Song Poh | 2015-12-08 |
| 9209147 | Method of forming pillar bump | Chee Seng Foong, Navas Khan Oratti Kalandar, Zi Song Poh | 2015-12-08 |