Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997445 | Substrate interconnections for packaged semiconductor device | Chee Seng Foong, Bihua He, Navas Khan Oratti Kalandar, Lan Chu Tan, Yuan Zang | 2018-06-12 |
| 9698093 | Universal BGA substrate | Chee Seng Foong, Ly Hoon Khoo, Wen Shi Koh, Wai Yew Lo, Zi Song Poh | 2017-07-04 |
| 9646853 | IC device having patterned, non-conductive substrate | Poh Leng Eu | 2017-05-09 |
| 9437492 | Substrate for alternative semiconductor die configurations | Chee Seng Foong, Lan Chu Tan | 2016-09-06 |
| 9196576 | Semiconductor package with stress relief and heat spreader | Poh Leng Eu, Meng Kong Lye, You Ge, Penglin Mei | 2015-11-24 |
| 9165855 | Semiconductor device with die attached heat spreader | Poh Leng Eu | 2015-10-20 |
| 9030000 | Mold cap for semiconductor device | Poh Leng Eu, Boon Yew Low | 2015-05-12 |
| 8836091 | Lead frame for semiconductor package with enhanced stress relief | Alexander M. Arayata, Jian Wen | 2014-09-16 |
| 8643169 | Semiconductor sensor device with over-molded lid | Poh Leng Eu | 2014-02-04 |
| 8501517 | Method of assembling pressure sensor device | Poh Leng Eu | 2013-08-06 |
| 8415779 | Lead frame for semiconductor package | Tzu Ling Wong, Chee Seng Foong | 2013-04-09 |
| 8078353 | Self monitoring braking system for vehicles | Poh Leng Eu | 2011-12-13 |
| 7868449 | Semiconductor substrate and method of connecting semiconductor die to substrate | Poh Leng Eu | 2011-01-11 |
| 7759753 | Integrated circuit die, integrated circuit package, and packaging method | Poh Leng Eu | 2010-07-20 |