Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825757 | Semiconductor device and method with clip arrangement in IC package | Haibo Fan, Pompeo V. Umali, Tim Boettcher | 2020-11-03 |
| 10658274 | Electronic device | Tim Boettcher, Haibo Fan, Pompeo V. Umali, Shun Tik Yeung, Chi Ho Leung | 2020-05-19 |
| 10269751 | Leadless package with non-collapsible bump | On Lok Chau | 2019-04-23 |
| 7112871 | Flipchip QFN package | Hei Ming Shiu, Qing-Chun He | 2006-09-26 |
| 7056766 | Method of forming land grid array packaged device | Hei Ming Shiu, Nan Xu | 2006-06-06 |
| 7033866 | Method for making dual gauge leadframe | Zhi-Gang Bai, Clem H. Brown | 2006-04-25 |
| 6958261 | Optical sensor package | Man Hon Cheng, Wai Keung Ho | 2005-10-25 |
| 6949816 | Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same | Clem H. Brown, Frank J. Mosna, Jr. | 2005-09-27 |
| 6917097 | Dual gauge leadframe | Zhi-Gang Bai, Clem H. Brown | 2005-07-12 |
| 6905910 | Method of packaging an optical sensor | Hei Ming Shiu, Kam Lee | 2005-06-14 |
| 6875635 | Method of attaching a die to a substrate | Man Hon Cheng, Wai Keung Ho | 2005-04-05 |
| 6867072 | Flipchip QFN package and method therefor | Hei Ming Shiu, Qing-Chun He | 2005-03-15 |
| 6838751 | Multi-row leadframe | Man Hon Cheng, Fei Ying Wong | 2005-01-04 |
| 6798074 | Method of attaching a die to a substrate | Man Hon Cheng, Wai Keung Ho | 2004-09-28 |
| 6667543 | Optical sensor package | Man Hon Cheng, Wai Keung Ho | 2003-12-23 |