Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7205178 | Land grid array packaged device and method of forming same | Hei Ming Shiu, Ho Wong | 2007-04-17 |
| 6905910 | Method of packaging an optical sensor | Hei Ming Shiu, Wai Wong Chow | 2005-06-14 |