Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658274 | Electronic device | Tim Boettcher, Haibo Fan, Wai Wong Chow, Pompeo V. Umali, Shun Tik Yeung | 2020-05-19 |
| 10529644 | Semiconductor device | Shun Tik Yeung, Pompeo V. Umali, Hans-Juergen Funke, Wolfgang Schnitt, Zhihao Pan | 2020-01-07 |
| 10410941 | Wafer level semiconductor device with wettable flanks | Pompeo V. Umali, Shun Tik Yeung, Kan Wae Lam | 2019-09-10 |
| 10304759 | Electronic device and method of making same | Kan Wae Lam, Shun Tik Yeung, Pompeo V. Umali, Chi Ling Shum | 2019-05-28 |
| 10262926 | Reversible semiconductor die | Kan Wae Lam, Harrie Horstink, Sven Walczyk, Thierry Jans, Pompeo V. Umali +1 more | 2019-04-16 |
| 10256168 | Semiconductor device and lead frame therefor | Shun Tik Yeung, Pompeo V. Umali, Kan Wae Lam, Hans-Juergen Funke, Shu-ming Yip | 2019-04-09 |
| 9947632 | Semiconductor device and method of making a semiconductor device | Pompeo V. Umali, Shun Tik Yeung, Wai (Kan Wae) Lam | 2018-04-17 |
| 9640463 | Built-up lead frame package and method of making thereof | Kan Wae Lam, Pompeo V. Umali, Shun Tik Yeung, Chi Ling Shum | 2017-05-02 |
| 9634739 | Wireless communication system and method thereof | Yuet Fong | 2017-04-25 |
| 9443791 | Leadless semiconductor package and method | Ke Xue, Soenke Habenicht, Wai Hung William Hor, San Ming Chan, Wai Keung Ng | 2016-09-13 |
| 9425130 | Package with multiple I/O side-solderable terminals | Wai Hung William Hor, Soenke Habenicht, Pompeo V. Umali, WaiKeung Ho, Yee Wai Fung | 2016-08-23 |
| 9391007 | Built-up lead frame QFN and DFN packages and method of making thereof | Shun Tik Yeung, Pompeo V. Umali, Kan Wae Lam, Chi Ling Shum | 2016-07-12 |