Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227820 | Through hole side wettable flank | Kan Wae Lam, Sven Walczyk, Hans-Juergen Funke | 2022-01-18 |
| 9443791 | Leadless semiconductor package and method | Chi Ho Leung, Ke Xue, Soenke Habenicht, San Ming Chan, Wai Keung Ng | 2016-09-13 |
| 9425130 | Package with multiple I/O side-solderable terminals | Chi Ho Leung, Soenke Habenicht, Pompeo V. Umali, WaiKeung Ho, Yee Wai Fung | 2016-08-23 |