Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990394 | Semiconductor package and a method for manufacturing of a semiconductor package | Kim Chai Ng, On Lok Chau, Raymond Wong | 2024-05-21 |
| 9847283 | Semiconductor device with wettable corner leads | Xue Ke, Kan Wae Lam, Sven Walczyk, Wing Onn Chaw | 2017-12-19 |
| 7301225 | Multi-row lead frame | Fei Ying Wong, Ho Wong | 2007-11-27 |
| 6958261 | Optical sensor package | Wai Wong Chow, Man Hon Cheng | 2005-10-25 |
| 6875635 | Method of attaching a die to a substrate | Man Hon Cheng, Wai Wong Chow | 2005-04-05 |
| 6798074 | Method of attaching a die to a substrate | Man Hon Cheng, Wai Wong Chow | 2004-09-28 |
| 6667543 | Optical sensor package | Wai Wong Chow, Man Hon Cheng | 2003-12-23 |
| 5793123 | Electronic device with two power supply modes | Michel Grossier, Jacques Mingot | 1998-08-11 |