Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7261230 | Wirebonding insulated wire and capillary therefor | Fuaida Harun, Chiaw Mong Chan, Lau Teck Beng, Kong Bee Tiu, Soo San Yong | 2007-08-28 |
| 7160798 | Method of making reinforced semiconductor package | Viswanadam Gautham | 2007-01-09 |
| 7042098 | Bonding pad for a packaged integrated circuit | Fuaida Harun, Liang Koh | 2006-05-09 |
| 6933614 | Integrated circuit die having a copper contact and method therefor | Chu-Chung Lee, Fuaida Harun, Kevin J. Hess, Cheng Choi Yong | 2005-08-23 |
| 6900531 | Image sensor device | Chee Seng Foong, Kok Mui, Kim Heng Tan | 2005-05-31 |
| 6693020 | Method of preparing copper metallization die for wirebonding | Kok Mui, Fuaida Harun, Mohd Faizairi Bin Mohd Nor | 2004-02-17 |
| 6563226 | Bonding pad | Fuaida Harun | 2003-05-13 |