Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6693020 | Method of preparing copper metallization die for wirebonding | Kok Mui, Fuaida Harun, Lan Chu Tan | 2004-02-17 |
MN
Mohd Faizairi Bin Mohd Nor
Overall (All Time): #3,470,334 of 4,157,543Top 85%
1
Patents All Time