Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096508 | Assembly for handling a semiconductor die and method of handling a semiconductor die | Ronald Paramio Joves, Thanabal Ganesh Kunamani, Kuang Ming Lee, Avelino Oliveros Sumagpoa, Kian Heong Tan +2 more | 2018-10-09 |
| 8334586 | Stacked semiconductor chips with separate encapsulations | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Kwai Hong Wong | 2012-12-18 |
| 7969018 | Stacked semiconductor chips with separate encapsulations | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Kwai Hong Wong | 2011-06-28 |
| 7939381 | Method of semiconductor packaging and/or a semiconductor package | — | 2011-05-10 |
| 7795712 | Lead frame with non-conductive connective bar | Alvin Wee Beng Tatt, Fuaida Harun, Robert-Christian Hagen, Yang Hong Heng, Kean Cheong Lee | 2010-09-14 |
| 7723165 | Method of forming component package | Wae Chet Yong, Stanley Job Doraisamy | 2010-05-25 |