Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8664753 | Semiconductor device with protruding component portion and method of packaging | Teck Sim Lee, Chee Voon Tan | 2014-03-04 |
| 8334586 | Stacked semiconductor chips with separate encapsulations | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Soon Hock Tong | 2012-12-18 |
| 7969018 | Stacked semiconductor chips with separate encapsulations | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Soon Hock Tong | 2011-06-28 |