Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341089 | Device package substrate structure and method therefor | Chee Seng Foong, Tingdong Zhou | 2025-06-24 |
| 11798871 | Device package substrate structure and method therefor | Chee Seng Foong, Tingdong Zhou | 2023-10-24 |
| 11018024 | Method of fabricating embedded traces | Chee Seng Foong | 2021-05-25 |
| 10037970 | Multiple interconnections between die | David Clegg, James S. Golab, Tingdong Zhou | 2018-07-31 |
| 9935079 | Laser sintered interconnections between die | Chee Seng Foong, Leo M. Higgins, III | 2018-04-03 |
| 9703056 | Copper tube interconnect | Sriram Subramanian Neelakantan | 2017-07-11 |
| 9659831 | Methods and structures for detecting low strength in an interlayer dielectric structure | Ilko Schmadlak | 2017-05-23 |
| 9548256 | Heat spreader and method for forming | — | 2017-01-17 |
| 9496212 | Substrate core via structure | — | 2016-11-15 |
| 9466544 | Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device | — | 2016-10-11 |
| 9385064 | Heat sink having a through-opening | — | 2016-07-05 |
| 9373539 | Collapsible probe tower device and method of forming thereof | Kelly F. Folts | 2016-06-21 |
| 9324667 | Semiconductor devices with compliant interconnects | Lawrence S. Klingbeil, Jr., Mostafa Vadipour, Brett P. Wilkerson, Leo M. Higgins, III | 2016-04-26 |
| 9093515 | Wire bonding capillary with working tip protrusion | Ilko Schmadlak | 2015-07-28 |
| 9070657 | Heat conductive substrate for integrated circuit package | Tim V. Pham, Derek S. Swanson | 2015-06-30 |
| 8994190 | Low-temperature flip chip die attach | — | 2015-03-31 |
| 8895409 | Semiconductor wafer plating bus and method for forming | — | 2014-11-25 |
| 8766453 | Packaged integrated circuit having large solder pads and method for forming | Brett P. Wilkerson | 2014-07-01 |
| 8704370 | Semiconductor package structure having an air gap and method for forming | Burton J. Carpenter, Brett P. Wilkerson | 2014-04-22 |
| 8519513 | Semiconductor wafer plating bus | — | 2013-08-27 |
| 8368172 | Fused buss for plating features on a semiconductor die | George R. Leal, Kevin J. Hess | 2013-02-05 |
| 8349666 | Fused buss for plating features on a semiconductor die | George R. Leal, Kevin J. Hess | 2013-01-08 |
| 8314026 | Anchored conductive via and method for forming | — | 2012-11-20 |
| 8008786 | Dynamic pad size to reduce solder fatigue | Tim V. Pham | 2011-08-30 |
| 7772104 | Dynamic pad size to reduce solder fatigue | Tim V. Pham | 2010-08-10 |