Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9070657 | Heat conductive substrate for integrated circuit package | Tim V. Pham, Trent S. Uehling | 2015-06-30 |
| 8754518 | Devices and methods for configuring conductive elements for a semiconductor package | Burton J. Carpenter | 2014-06-17 |