Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7276435 | Die level metal density gradient for improved flip chip package reliability | Scott K. Pozder, Kevin J. Hess, Ruiqi Tian, Edward O. Travis, Brett P. Wilkerson +1 more | 2007-10-02 |
| 7129566 | Scribe street structure for backend interconnect semiconductor wafer integration | Kevin J. Hess | 2006-10-31 |
| 6951801 | Metal reduction in wafer scribe area | Scott K. Pozder, Lakshmi N. Ramanathan | 2005-10-04 |