Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780051 | Methods for forming semiconductor devices with stepped bond pads | Tu-Anh N. Tran | 2017-10-03 |
| 9209078 | Method of making a die with recessed aluminum die pads | Gregory S. Spencer, Philip E. Crabtree, Dean J. Denning, Gerald A. Martin | 2015-12-08 |
| 8722530 | Method of making a die with recessed aluminum die pads | Gregory S. Spencer, Phillip E. Crabtree, Dean J. Denning, Gerald A. Martin | 2014-05-13 |
| 8039389 | Semiconductor device having an organic anti-reflective coating (ARC) and method therefor | Douglas M. Reber, Mark D. Hall, Kyle Patterson, Tab A. Stephens, Edward K. Theiss +2 more | 2011-10-18 |
| 7799678 | Method for forming a through silicon via layout | Thomas J. Kropewnicki, Ritwik Chatterjee | 2010-09-21 |
| 7776731 | Method of removing defects from a dielectric material in a semiconductor | Tien Ying Luo, Dina H. Triyoso | 2010-08-17 |
| 7700499 | Multilayer silicon nitride deposition for a semiconductor device | Paul A. Grudowski, Xiang-Zheng Bo, Tien Ying Luo | 2010-04-20 |
| 7678698 | Method of forming a semiconductor device with multiple tensile stressor layers | Xiangzheng Bo, Tien Ying Luo, Paul A. Grudowski, Venkat R. Kolagunta | 2010-03-16 |
| 7678665 | Deep STI trench and SOI undercut enabling STI oxide stressor | Michael D. Turner, Suresh Venkatesan | 2010-03-16 |
| 7579228 | Disposable organic spacers | Paul A. Grudowski, Thomas J. Kropewnicki, Andrew G. Nagy | 2009-08-25 |
| 7279433 | Deposition and patterning of boron nitride nanotube ILD | Peter L. G. Ventzek, Marius Orlowski | 2007-10-09 |
| 7199429 | Semiconductor device having an organic anti-reflective coating (ARC) and method therefor | Douglas M. Reber, Mark D. Hall, Kyle Patterson, Tab A. Stephens, Edward K. Theiss +2 more | 2007-04-03 |
| 7176130 | Plasma treatment for surface of semiconductor device | Jin Miao Shen, Brian Fisher, Mark D. Hall, Vikas R. Sheth, Mehul D. Shroff | 2007-02-13 |
| 7144803 | Methods of forming boron carbo-nitride layers for integrated circuit devices | Edward R. Engbrecht, John Ekerdt, Yang Sun | 2006-12-05 |
| 7109101 | Capping layer for reducing amorphous carbon contamination of photoresist in semiconductor device manufacture; and process for making same | Marilyn I. Wright, Srikanteswara Dakshina-Murthy, Kyle Patterson | 2006-09-19 |
| 6992003 | Integration of ultra low K dielectric in a semiconductor fabrication process | Gregory S. Spencer, Jason A. Vires | 2006-01-31 |
| 6972255 | Semiconductor device having an organic anti-reflective coating (ARC) and method therefor | Douglas M. Reber, Mark D. Hall, Kyle Patterson, Tab A. Stephens, Edward K. Theiss +2 more | 2005-12-06 |
| 6475930 | UV cure process and tool for low k film formation | Nicole R. Grove, Marijean E. Azrak | 2002-11-05 |