Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8722530 | Method of making a die with recessed aluminum die pads | Gregory S. Spencer, Dean J. Denning, Kurt H. Junker, Gerald A. Martin | 2014-05-13 |
| 7256113 | System for forming a semiconductor device and method thereof | Kay Hellig, Massud Aminpur | 2007-08-14 |
| 6232134 | Method and apparatus for monitoring wafer characteristics and/or semiconductor processing consistency using wafer charge distribution measurements | David Gerald Farber, Wei E. Wu | 2001-05-15 |
| 6146948 | Method for manufacturing a thin oxide for use in semiconductor integrated circuits | Wei E. Wu, Hsing-Huang Tseng, Yeong-Jyh T. Lii | 2000-11-14 |
| 6054377 | Method for forming an inlaid via in a semiconductor device | Stanley M. Filipiak, John C. Arnold | 2000-04-25 |