Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7763538 | Dual plasma treatment barrier film to reduce low-k damage | Michael D. Turner, Ritwik Chatterjee | 2010-07-27 |
| 7592273 | Semiconductor device with hydrogen barrier and method therefor | Zhi-Xiong Jiang, Mehul D. Shroff | 2009-09-22 |
| 7442598 | Method of forming an interlayer dielectric | Paul A. Grudowski, Yongloo Jeon, Chad Weintraub | 2008-10-28 |
| 7422979 | Method of forming a semiconductor device having a diffusion barrier stack and structure thereof | Lynne Michaelson, Edward Acosta, Ritwik Chatterjee, Sam S. Garcia, Varughese Mathew | 2008-09-09 |
| 7157377 | Method of making a semiconductor device using treated photoresist | Cesar M. Garza, William D. Darlington, James E. Vasek | 2007-01-02 |
| 7074713 | Plasma enhanced nitride layer | Jian Chen, Yongjoo Jeon, Tab A. Stephens | 2006-07-11 |
| 6838354 | Method for forming a passivation layer for air gap formation | Cindy Goldberg, John C. Flake, Yeong-Jyh T. Lii, Bradley P. Smith, Yuri Solomentsev +3 more | 2005-01-04 |
| 6686633 | Semiconductor device, memory cell, and processes for forming them | Craig S. Lage, Mousumi Bhat, Yeong-Jyh T. Lii, Andrew G. Nagy, Larry E. Frisa +5 more | 2004-02-03 |
| 6475925 | Reduced water adsorption for interlayer dielectric | Gregor Braeckelmann | 2002-11-05 |
| 6287951 | Process for forming a combination hardmask and antireflective layer | Kevin Lucas, Christopher D. Pettinato, Wayne Clark, Yeong-Jyh T. Lii | 2001-09-11 |
| 6284633 | Method for forming a tensile plasma enhanced nitride capping layer over a gate electrode | Rajan Nagabushnam, Bruce Boeck | 2001-09-04 |
| 6218733 | Semiconductor device having a titanium-aluminum compound | Robert W. Fiordalice, Johnson O. Olowolafe, Hisao Kawasaki | 2001-04-17 |
| 6184073 | Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region | Craig S. Lage, Mousumi Bhat, Yeong-Jyh T. Lii, Andrew G. Nagy, Larry E. Frisa +5 more | 2001-02-06 |
| 6174810 | Copper interconnect structure and method of formation | Rabiul Islam, Avgerinos V. Gelatos, Kevin Lucas, Ramnath Venkatraman | 2001-01-16 |
| 6054377 | Method for forming an inlaid via in a semiconductor device | John C. Arnold, Phillip E. Crabtree | 2000-04-25 |
| 5918147 | Process for forming a semiconductor device with an antireflective layer | Ted R. White, T. P. Ong, Jung-Hui Lin, Wayne M. Paulson, Bernard J. Roman | 1999-06-29 |
| 5447887 | Method for capping copper in semiconductor devices | Avgerinos V. Gelatos | 1995-09-05 |
| 5358901 | Process for forming an intermetallic layer | Robert W. Fiordalice, Johnson O. Olowolafe, Hisao Kawasaki | 1994-10-25 |
| 5310626 | Method for forming a patterned layer using dielectric materials as a light-sensitive material | Mark G. Fernandes, Jeffrey T. Wetzel | 1994-05-10 |
| 5188979 | Method for forming a nitride layer using preheated ammonia | — | 1993-02-23 |
| 5126283 | Process for the selective encapsulation of an electrically conductive structure in a semiconductor device | Faivel Pintchovski, John R. Yeargain | 1992-06-30 |