Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10922151 | Unified events framework | Harry Lube, Aparajita | 2021-02-16 |
| 8586474 | Method to form a via | Eddie Acosta, Sam S. Garcia, Varughese Mathew | 2013-11-19 |
| 8581383 | 3-D semiconductor die structure with containing feature and method | Scott K. Pozder | 2013-11-12 |
| 8003517 | Method for forming interconnects for 3-D applications | Varughese Mathew, Eddie Acosta, Sam S. Garcia | 2011-08-23 |
| 7993971 | Forming a 3-D semiconductor die structure with an intermetallic formation | Eddic Acosta, Varughese Mathew | 2011-08-09 |
| 7932175 | Method to form a via | Eddie Acosta, Sam S. Garcia, Varughese Mathew | 2011-04-26 |
| 7811932 | 3-D semiconductor die structure with containing feature and method | Scott K. Pozder | 2010-10-12 |
| 7807572 | Micropad formation for a semiconductor | Varughese Mathew, Eddie Acosta, Sam S. Garcia | 2010-10-05 |
| 7799678 | Method for forming a through silicon via layout | Thomas J. Kropewnicki, Kurt H. Junker | 2010-09-21 |
| 7763538 | Dual plasma treatment barrier film to reduce low-k damage | Michael D. Turner, Stanley M. Filipiak | 2010-07-27 |
| 7579258 | Semiconductor interconnect having adjacent reservoir for bonding and method for formation | — | 2009-08-25 |
| 7572723 | Micropad for bonding and a method therefor | Varughese Mathew, Eddie Acosta, Sam S. Garcia | 2009-08-11 |
| 7422979 | Method of forming a semiconductor device having a diffusion barrier stack and structure thereof | Lynne Michaelson, Edward Acosta, Stanley M. Filipiak, Sam S. Garcia, Varughese Mathew | 2008-09-09 |