Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8586474 | Method to form a via | Ritwik Chatterjee, Sam S. Garcia, Varughese Mathew | 2013-11-19 |
| 8003517 | Method for forming interconnects for 3-D applications | Varughese Mathew, Ritwik Chatterjee, Sam S. Garcia | 2011-08-23 |
| 7932175 | Method to form a via | Ritwik Chatterjee, Sam S. Garcia, Varughese Mathew | 2011-04-26 |
| 7807572 | Micropad formation for a semiconductor | Varughese Mathew, Ritwik Chatterjee, Sam S. Garcia | 2010-10-05 |
| 7572723 | Micropad for bonding and a method therefor | Varughese Mathew, Ritwik Chatterjee, Sam S. Garcia | 2009-08-11 |