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Low damage low-k dielectric etch |
Ping Jiang |
2019-10-22 |
| 9881795 |
Method of fabricating semiconductors |
Ping Jiang, Brian K. Kirkpatrick, Douglas Ticknor Grider |
2018-01-30 |
| 9704720 |
Uniform, damage free nitride ETCH |
Tom Lii |
2017-07-11 |
| 9490143 |
Method of fabricating semiconductors |
Ping Jiang, Brian K. Kirkpatrick, Douglas Ticknor Grider |
2016-11-08 |
| 9437449 |
Uniform, damage free nitride etch |
Tom Lii |
2016-09-06 |
| 9224657 |
Hard mask for source/drain epitaxy control |
Tom Lii, Brian K. Kirkpatrick |
2015-12-29 |
| 9054158 |
Method of forming a metal contact opening with a width that is smaller than the minimum feature size of a photolithographically-defined opening |
Tom Lii, Steve Lytle |
2015-06-09 |
| 8665592 |
Heat management using power management information |
Anthony Mowry, Michael J. Austin, John E. Moore, Jr. |
2014-03-04 |
| 8564120 |
Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside |
Anthony Mowry, Fred N. Hause, Markus Lenski |
2013-10-22 |
| 8507386 |
Lateral uniformity in silicon recess etch |
Tom Lii |
2013-08-13 |
| 8064197 |
Heat management using power management information |
Anthony Mowry, Michael J. Austin, John E. Moore, Jr. |
2011-11-22 |
| 7745337 |
Method of optimizing sidewall spacer size for silicide proximity with in-situ clean |
Fred N. Hause, Markus Lenski, Anthony Mowry |
2010-06-29 |
| 7741663 |
Air gap spacer formation |
Fred N. Hause, Anthony Mowry, Markus Lenski |
2010-06-22 |
| 7687407 |
Method for reducing line edge roughness for conductive features |
Brian E. Goodllin, Robert J. Kraft |
2010-03-30 |
| 7112288 |
Methods for inspection sample preparation |
Fred Y. Clark, Andrew Vance |
2006-09-26 |
| 7087518 |
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface |
William W. Dostalik, Robert J. Kraft, Andrew John McKerrow, Kenneth Newton, Ting Tsui |
2006-08-08 |
| 6780756 |
Etch back of interconnect dielectrics |
Ting Tsui, Robert J. Kraft, Craig Huffman |
2004-08-24 |
| 6245686 |
Process for forming a semiconductor device and a process for operating an apparatus |
Jeffrey D. Rose, Michael J. Hartig, Danny R. Babbitt, Jason A. Rivers, Ai Koh +1 more |
2001-06-12 |
| 6232134 |
Method and apparatus for monitoring wafer characteristics and/or semiconductor processing consistency using wafer charge distribution measurements |
Wei E. Wu, Phillip E. Crabtree |
2001-05-15 |
