Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453700 | Low damage low-k dielectric etch | Ping Jiang | 2019-10-22 |
| 9881795 | Method of fabricating semiconductors | Ping Jiang, Brian K. Kirkpatrick, Douglas Ticknor Grider | 2018-01-30 |
| 9704720 | Uniform, damage free nitride ETCH | Tom Lii | 2017-07-11 |
| 9490143 | Method of fabricating semiconductors | Ping Jiang, Brian K. Kirkpatrick, Douglas Ticknor Grider | 2016-11-08 |
| 9437449 | Uniform, damage free nitride etch | Tom Lii | 2016-09-06 |
| 9224657 | Hard mask for source/drain epitaxy control | Tom Lii, Brian K. Kirkpatrick | 2015-12-29 |
| 9054158 | Method of forming a metal contact opening with a width that is smaller than the minimum feature size of a photolithographically-defined opening | Tom Lii, Steve Lytle | 2015-06-09 |
| 8665592 | Heat management using power management information | Anthony Mowry, Michael J. Austin, John E. Moore, Jr. | 2014-03-04 |
| 8564120 | Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside | Anthony Mowry, Fred N. Hause, Markus Lenski | 2013-10-22 |
| 8507386 | Lateral uniformity in silicon recess etch | Tom Lii | 2013-08-13 |
| 8064197 | Heat management using power management information | Anthony Mowry, Michael J. Austin, John E. Moore, Jr. | 2011-11-22 |
| 7745337 | Method of optimizing sidewall spacer size for silicide proximity with in-situ clean | Fred N. Hause, Markus Lenski, Anthony Mowry | 2010-06-29 |
| 7741663 | Air gap spacer formation | Fred N. Hause, Anthony Mowry, Markus Lenski | 2010-06-22 |
| 7687407 | Method for reducing line edge roughness for conductive features | Brian E. Goodllin, Robert J. Kraft | 2010-03-30 |
| 7112288 | Methods for inspection sample preparation | Fred Y. Clark, Andrew Vance | 2006-09-26 |
| 7087518 | Method of passivating and/or removing contaminants on a low-k dielectric/copper surface | William W. Dostalik, Robert J. Kraft, Andrew John McKerrow, Kenneth Newton, Ting Tsui | 2006-08-08 |
| 6780756 | Etch back of interconnect dielectrics | Ting Tsui, Robert J. Kraft, Craig Huffman | 2004-08-24 |
| 6245686 | Process for forming a semiconductor device and a process for operating an apparatus | Jeffrey D. Rose, Michael J. Hartig, Danny R. Babbitt, Jason A. Rivers, Ai Koh +1 more | 2001-06-12 |
| 6232134 | Method and apparatus for monitoring wafer characteristics and/or semiconductor processing consistency using wafer charge distribution measurements | Wei E. Wu, Phillip E. Crabtree | 2001-05-15 |