Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12199085 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2025-01-14 | |
| 11817444 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2023-11-14 | $31,444,000 |
| 11348911 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2022-05-31 | $16,893,000 |
| 11122678 | Packaged device having imbedded array of components | Vijaykumar Krithivasan, Jin Zhao, Mengzhi Pang, Steven Butler, Ganesh Venkataramanan | 2021-09-14 | |
| 10700051 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2020-06-30 | $33,333,000 |
| 7144803 | Methods of forming boron carbo-nitride layers for integrated circuit devices | Edward R. Engbrecht, John Ekerdt, Kurt H. Junker | 2006-12-05 |