Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199085 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2025-01-14 |
| 11817444 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2023-11-14 |
| 11348911 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2022-05-31 |
| 11122678 | Packaged device having imbedded array of components | Vijaykumar Krithivasan, Jin Zhao, Mengzhi Pang, Steven Butler, Ganesh Venkataramanan | 2021-09-14 |
| 10700051 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2020-06-30 |
| 7144803 | Methods of forming boron carbo-nitride layers for integrated circuit devices | Edward R. Engbrecht, John Ekerdt, Kurt H. Junker | 2006-12-05 |