Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199085 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2025-01-14 |
| 11817444 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2023-11-14 |
| 11348911 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2022-05-31 |
| 10700051 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2020-06-30 |
| 9698108 | Structures to mitigate contamination on a back side of a semiconductor substrate | Xavier Francois Brun, Shweta Agrawal, Hao Wu, Mohit Mamodia, Hualiang Shi | 2017-07-04 |
| 8970051 | Solution to deal with die warpage during 3D die-to-die stacking | Hualiang Shi, Sairam Agraharam, Tyler N. Osborn | 2015-03-03 |