SS

Sven Schmidbauer

Infineon Technologies Ag: 9 patents #1,105 of 7,486Top 15%
IA Infineon Technologies Austria Ag: 4 patents #261 of 1,126Top 25%
QA Qimonda Ag: 2 patents #153 of 575Top 30%
ID Infineon Technologies Dresden: 2 patents #62 of 150Top 45%
NT Nanya Technology: 1 patents #447 of 775Top 60%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
IBM: 1 patents #44,794 of 70,183Top 65%
📍 Dresden, DE: #90 of 3,254 inventorsTop 3%
Overall (All Time): #248,551 of 4,157,543Top 6%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
12159854 Semiconductor device having a layer stack, semiconductor arrangement and method for producing the same Paul Frank, Thomas Heinelt, Oliver Schilling, Frank Wagner 2024-12-03
11887961 Semiconductor device, semiconductor arrangement and method for producing the same Paul Frank, Thomas Heinelt, Oliver Schilling, Frank Wagner 2024-01-30
10978395 Method of manufacturing a semiconductor device having a power metallization structure Ravi Keshav Joshi, Rainer Pelzer, Axel Bürke, Michael Nelhiebel 2021-04-13
10734320 Power metallization structure for semiconductor devices Ravi Keshav Joshi, Rainer Pelzer, Axel Buerke, Michael Nelhiebel 2020-08-04
10044005 Electrode, an electronic device, and a method for manufacturing an optoelectronic device Dirk Meinhold, Markus Fischer, Norbert Urbansky 2018-08-07
9419181 Electrode, an electronic device, and a method for manufacturing an optoelectronic device Dirk Meinhold, Markus Fischer, Norbert Urbansky 2016-08-16
8652890 Methods for fabricating integrated circuits with narrow, metal filled openings Dina H. Triyoso, Elke Erben, Hao Zhang, Robert Binder 2014-02-18
7825013 Integrated circuit comprising an amorphous region and method of manufacturing an integrated circuit Matthias Goldbach, Dietmar Henke 2010-11-02
7718475 Method for manufacturing an integrated circuit including a transistor Matthias Goldbach, Erhard Landgraf, Michael Stadtmueller, Moritz Haupt, Tobias Mono +1 more 2010-05-18
7341950 Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layers Yi-Jen Lo, Axel Buerke, Chiang-Hung Lin 2008-03-11
7214610 Process for producing aluminum-filled contact holes Jens Hahn 2007-05-08
6855630 Method for making contact with a doping region of a semiconductor component Alexander Ruf, Norbert Urbansky, Wilhelm Claussen, Thomas Gartner 2005-02-15
6602788 Process for fabricating an interconnect for contact holes Axel Bürke, Jens Hahn 2003-08-05
6579786 Method for depositing a two-layer diffusion barrier Alexander Ruf 2003-06-17
6403473 Process for producing metal-containing layers Alexander Ruf, Oliver Gehring 2002-06-11
6365510 Method for fabricating a contact layer Norbert Urbansky 2002-04-02
6221757 Method of making a microelectronic structure Alexander Ruf, Florian Schnabel, Mark Hoinkis, Stefan Weber 2001-04-24
6136709 Metal line deposition process Stefan Weber, Peter Weigand, Larry Clevenger, Roy Iggulden 2000-10-24