| 8465657 |
Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability |
Kaushik Chanda, James J. Demarest, Ronald G. Filippi, Edward W. Kiewara, Ping-Chuan Wang +1 more |
2013-06-18 |
| 7560375 |
Gas dielectric structure forming methods |
Ronald G. Filippi, Edward W. Kiewra, Ping-Chuan Wang |
2009-07-14 |
| 7473636 |
Method to improve time dependent dielectric breakdown |
Kaushik Chanda, James J. Demarest, Ronald G. Filippi, Edward W. Kiewra, Vincent J. McGahay +2 more |
2009-01-06 |
| 7361584 |
Detection of residual liner materials after polishing in damascene process |
Ronald G. Filippi, Edward W. Kiewra, Stephen K. Loh, Ping-Chuan Wang |
2008-04-22 |
| 7287325 |
Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing |
Kaushik Chanda, James J. Demarest, Ronald G. Filippi, Edward W. Kiewra, Ping-Chuan Wang +1 more |
2007-10-30 |
| 7119545 |
Capacitive monitors for detecting metal extrusion during electromigration |
Ishtiaq Ahsan, Ronald G. Filippi, Edward W. Kiewra, Ping-Chuan Wang |
2006-10-10 |
| 6960306 |
Low Cu percentages for reducing shorts in AlCu lines |
Padraic Shafer, Kwong Hon Wong, Michael Iwatake, Jay William Strane, Thomas Goebel +4 more |
2005-11-01 |
| 6887785 |
Etching openings of different depths using a single mask layer method and structure |
David M. Dobuzinsky, Carl Radens, Jay William Strane, Keith Kwong Hon Wong |
2005-05-03 |
| 6870263 |
Device interconnection |
Lawrence A. Clevenger, Ronald G. Filippi, Mark Hoinkis, Jeffery L. Hurd, Herbert Palm +5 more |
2005-03-22 |
| 6734097 |
Liner with poor step coverage to improve contact resistance in W contacts |
Padraic Shafer, Werner Robl, Kwong Hon Wong |
2004-05-11 |
| 6635564 |
Semiconductor structure and method of fabrication including forming aluminum columns |
Stefan Weber |
2003-10-21 |
| 6448173 |
Aluminum-based metallization exhibiting reduced electromigration and method therefor |
Lawrence A. Clevenger, Ronald G. Filippi, Kenneth P. Rodbell, Chao-Kun Hu, Lynne M. Gignac +3 more |
2002-09-10 |
| 6444565 |
Dual-rie structure for via/line interconnections |
Christopher Adam Feild, Rajiv V. Joshi, Edward W. Kiewra |
2002-09-03 |
| 6433436 |
Dual-RIE structure for via/line interconnections |
Christopher Adam Feild, Rajiv V. Joshi, Edward W. Kiewra |
2002-08-13 |
| 6413866 |
Method of forming a solute-enriched layer in a substrate surface and article formed thereby |
Horatio S. Wildman, Lawrence A. Clevenger, Chenting Lin, Kenneth P. Rodbell, Stefan Weber +2 more |
2002-07-02 |
| 6383920 |
Process of enclosing via for improved reliability in dual damascene interconnects |
Ping-Chuan Wang, Ronald G. Filippi, Robert D. Edwards, Edward W. Kiewra |
2002-05-07 |
| 6361880 |
CVD/PVD/CVD/PVD fill process |
Larry Clevenger, Rainer Florian Schnabel, Stefan Weber |
2002-03-26 |
| 6252292 |
Vertical electrical cavity-fuse |
Axel Brintzinger, Stefan Weber, Peter Weigand |
2001-06-26 |
| 6242789 |
Vertical fuse and method of fabrication |
Stefan Weber, Axel Brintzinger, Mark Hoinkis, Chandrasekhar Narayan, Robert Willem Van Den Berg |
2001-06-05 |
| 6218279 |
Vertical fuse and method of fabrication |
Stefan Weber, Axel Brintzinger, Mark Hoinkis, Chandrasekhar Narayan, Robert Willem Van Den Berg |
2001-04-17 |
| 6136709 |
Metal line deposition process |
Sven Schmidbauer, Stefan Weber, Peter Weigand, Larry Clevenger |
2000-10-24 |
| 6057236 |
CVD/PVD method of filling structures using discontinuous CVD AL liner |
Larry Clevenger, Mark Hoinkis, Stefan Weber |
2000-05-02 |
