Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960306 | Low Cu percentages for reducing shorts in AlCu lines | Roy Iggulden, Kwong Hon Wong, Michael Iwatake, Jay William Strane, Thomas Goebel +4 more | 2005-11-01 |
| 6936512 | Semiconductor method and structure for simultaneously forming a trench capacitor dielectric and trench sidewall device dielectric | Michael P. Chudzik, Rajarao Jammy, Carl Radens, Kenneth T. Settlemyer, Jr., Joseph F. Shepard, Jr. | 2005-08-30 |
| 6869860 | Filling high aspect ratio isolation structures with polysilazane based material | Michael P. Belyansky, Rama Divakaruni, Laertis Economikos, Rajarao Jammy, Kenneth Settlemeyer | 2005-03-22 |
| 6740539 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more | 2004-05-25 |
| 6734097 | Liner with poor step coverage to improve contact resistance in W contacts | Roy Iggulden, Werner Robl, Kwong Hon Wong | 2004-05-11 |
| 6664161 | Method and structure for salicide trench capacitor plate electrode | Michael P. Chudzik, Jack A. Mandelman, Carl Radens, Rajarao Jammy, Kenneth T. Settlemyer, Jr. +1 more | 2003-12-16 |
| 6570256 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more | 2003-05-27 |