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Semiconductor device power metallization layer with stress-relieving heat sink structure |
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Electrolyte, method of forming a copper layer and method of forming a chip |
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Self-organizing barrier layer disposed between a metallization layer and a semiconductor region |
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Thomas Fischer, Juergen Foerster, Andreas Stueckjuergen |
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Integrated circuit and method of forming an integrated circuit |
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Semiconductor structure and method for making same |
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Semiconductor structure and method for making same |
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Semiconductor component with coreless transformer |
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2014-03-04 |
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Method for processing a semiconductor wafer or die, and particle deposition device |
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2012-12-18 |
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Semiconductor structure and method for making same |
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Semiconductor device including conductive element |
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Spin device |
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2011-07-05 |
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Low Cu percentages for reducing shorts in AlCu lines |
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Integration scheme for metal gap fill, with fixed abrasive CMP |
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Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level |
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