| 8725597 |
Merchant scoring system and transactional database |
Michael Jon Mauseth, Woodrow Arnold Jones, Jr., Joel R. Springer |
2014-05-13 |
$16,719,000 |
| 7928571 |
Device having dual etch stop liner and reformed silicide layer and related methods |
Dureseti Chidambarrao, Ying Li, Shreesh Narasimha |
2011-04-19 |
$4,236,000 |
| 7776695 |
Semiconductor device structure having low and high performance devices of same conductive type on same substrate |
John C. Arnold, Dureseti Chidambarrao, Ying Li, Shreesh Narasimha, Siddhartha Panda +2 more |
2010-08-17 |
$4,695,000 |
| 7732270 |
Device having enhanced stress state and related methods |
Dureseti Chidambarrao, Ying Li, Shreesh Narasimha, Haining Yang, Huilong Zhu |
2010-06-08 |
$3,517,000 |
| 7683434 |
Preventing cavitation in high aspect ratio dielectric regions of semiconductor device |
Paul D. Agnello, K. Paul Muller |
2010-03-23 |
$4,775,000 |
| 7627836 |
OPC trimming for performance |
James A. Culp, Lars Liebmann, K. Paul Muller, Shreesh Narasimha, Stephen L. Runyon +1 more |
2009-12-01 |
$16,004,000 |
| 7459384 |
Preventing cavitation in high aspect ratio dielectric regions of semiconductor device |
Paul D. Agnello, K. Paul Muller |
2008-12-02 |
$5,263,000 |
| 7446062 |
Device having dual etch stop liner and reformed silicide layer and related methods |
Dureseti Chidambarrao, Ying Li, Shreesh Narasimha |
2008-11-04 |
$6,466,000 |
| 7446395 |
Device having dual etch stop liner and protective layer |
Dureseti Chidambarrao, Ying Li, Shreesh Narasimha |
2008-11-04 |
$6,466,000 |
| 7348635 |
Device having enhanced stress state and related methods |
Dureseti Chidambarrao, Ying Li, Shreesh Narasimha, Haining Yang, Huilong Zhu |
2008-03-25 |
$5,860,000 |
| 7306983 |
Method for forming dual etch stop liner and protective layer in a semiconductor device |
Dureseti Chidambarrao, Ying Li, Shreesh Narasimha |
2007-12-11 |
$7,826,000 |
| 7030012 |
Method for manufacturing tungsten/polysilicon word line structure in vertical DRAM |
Ramachandra Divakaruni, Oleg Gluschenkov, Oh-Jung Kwon |
2006-04-18 |
$9,074,000 |
| 7018779 |
Apparatus and method to improve resist line roughness in semiconductor wafer processing |
Wai-Kin Li, Joseph J. Mezzapelle |
2006-03-28 |
$16,084,000 |
| 6908806 |
Gate metal recess for oxidation protection and parasitic capacitance reduction |
Haining Yang, Ramachandra Divakaruni, Oleg Gluschenkov, Hongwen Yan, Ravikumar Ramachandran |
2005-06-21 |
|
| 6897107 |
Method for forming TTO nitride liner for improved collar protection and TTO reliability |
Rama Divakaruni, Thomas W. Dyer, Jack A. Mandelman, Venkatachajam C. Jaiprakash |
2005-05-24 |
|
| 6809368 |
TTO nitride liner for improved collar protection and TTO reliability |
Rama Divakaruni, Thomas W. Dyer, Jack A. Mandelman, Venkatachalam C. Jaiprakash |
2004-10-26 |
$17,835,000 |
| 6794242 |
Extendible process for improved top oxide layer for DRAM array and the gate interconnects while providing self-aligned gate contacts |
Thomas W. Dyer, Andreas Knorr, Laertis Economikos, Scott D. Halle, Norbert Arnod |
2004-09-21 |
|
| 6794282 |
Three layer aluminum deposition process for high aspect ratio CL contacts |
Thomas Goebel, Werner Robl, Mihel Seitz |
2004-09-21 |
$92,000 |
| 6790739 |
Structure and methods for process integration in vertical DRAM cell fabrication |
Larry Nesbit, Jochen Beintner, Rama Divakaruni |
2004-09-14 |
$5,712,000 |
| 6724054 |
Self-aligned contact formation using double SiN spacers |
Woo-Tag Kang, Mihel Seitz |
2004-04-20 |
$84,000 |
| 6635526 |
Structure and method for dual work function logic devices in vertical DRAM process |
Rama Divakaruni, Rajesh Rengarajan |
2003-10-21 |
$216,000 |
| 6620676 |
Structure and methods for process integration in vertical DRAM cell fabrication |
Larry Nesbit, Jochen Beintner, Rama Divakaruni |
2003-09-16 |
$13,659,000 |
| 6541810 |
Modified vertical MOSFET and methods of formation thereof |
Ramachandra Divakaruni, Prakash Dev, Larry Nesbit |
2003-04-01 |
$11,931,000 |
| 6509226 |
Process for protecting array top oxide |
Venkatachalam C. Jaiprakash, Jack A. Mandelman, Ramachandra Divakaruni, Mihel Seitz |
2003-01-21 |
|
| 6358867 |
Orientation independent oxidation of silicon |
Helmut Tews, Jonathan E. Faltermeir, Carol J. Heenan, Oleg Gluschenkov |
2002-03-19 |
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