Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7514798 | Arrangement for the protection of three-dimensional structures on wafers | — | 2009-04-07 |
| 7393782 | Process for producing layer structures for signal distribution | Octavio Trovarelli, Wolfgang Leiberg | 2008-07-01 |
| 7390742 | Method for producing a rewiring printed circuit board | Stefan Ruckmich, Octavio Trovarelli, David Wallis, Ingo Uhlendorf | 2008-06-24 |
| 7368375 | Electronic component with compliant elevations having electrical contact areas and method for producing it | Stefan Ruckmich, Octavio Trovarelli | 2008-05-06 |
| 7335591 | Method for forming three-dimensional structures on a substrate | Ingo Uhlendorf | 2008-02-26 |
| 7332430 | Method for improving the mechanical properties of BOC module arrangements | Octavio Trovarelli | 2008-02-19 |
| 7271095 | Process for producing metallic interconnects and contact surfaces on electronic components | Octavio Trovarelli | 2007-09-18 |
| 7235859 | Arrangement and process for protecting fuses/anti-fuses | Octavio Trovarelli, David Wallis, Wolfgang Leiberg | 2007-06-26 |
| 7172966 | Method for fabricating metallic interconnects on electronic components | Octavio Trovarelli, Wolfgang Leiberg | 2007-02-06 |
| 7169647 | Connection between a semiconductor chip and an external conductor structure and method for producing it | Octavio Trovarelli, Ingo Uhlendorf, David Wallis | 2007-01-30 |
| 7115496 | Method for protecting the redistribution layer on wafers/chips | Octavio Trovarelli | 2006-10-03 |
| 7087975 | Area efficient stacking of antifuses in semiconductor device | Gunther Lehmann, Gabriel Daniel | 2006-08-08 |
| 6943101 | Manufacturing of a corrosion protected interconnect on a substrate | — | 2005-09-13 |
| 6919264 | Method for the solder-stop structuring of elevations on wafers | Ingo Uhlendorf, Andre Schenk, Alexander Wollanke | 2005-07-19 |
| 6911390 | Fabrication method for an interconnect on a substrate | — | 2005-06-28 |
| 6888215 | Dual damascene anti-fuse with via before wire | Carl Radens | 2005-05-03 |
| 6882027 | Methods and apparatus for providing an antifuse function | Carl Radens, William R. Tonti | 2005-04-19 |
| 6866943 | Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level | Gerald Friese, Werner Robl, Hans-Joachim Barth | 2005-03-15 |
| 6720212 | Method of eliminating back-end rerouting in ball grid array packaging | Werner Robl, Thomas Goebel, Gerald Friese | 2004-04-13 |
| 6638870 | Forming a structure on a wafer | Barbara Vasquez, Harry Hedler | 2003-10-28 |
| 6566238 | Metal wire fuse structure with cavity | Edward W. Kiewra, Chandrasekhar Narayan, Carl Radens | 2003-05-20 |
| 6509208 | Method for forming structures on a wafer | — | 2003-01-21 |
| 6495918 | Chip crack stop design for semiconductor chips | — | 2002-12-17 |
| 6495901 | Multi-level fuse structure | Chandrasekhar Narayan, David Lachtrupp, Kenneth C. Arndt | 2002-12-17 |
| 6486526 | Crack stop between neighboring fuses for protection from fuse blow damage | Chandrasekhar Narayan, Edward W. Kiewra, Carl Radens | 2002-11-26 |