Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8124521 | Electrical through contact | Harry Hedler, Roland Irsigler, Volker Lehmann, Thorsten Meyer | 2012-02-28 |
| 7906421 | Method for applying solder to redistribution lines | Martin Reiss, Bernd Zimmermann | 2011-03-15 |
| 7393782 | Process for producing layer structures for signal distribution | Axel Brintzinger, Wolfgang Leiberg | 2008-07-01 |
| 7390742 | Method for producing a rewiring printed circuit board | Axel Brintzinger, Stefan Ruckmich, David Wallis, Ingo Uhlendorf | 2008-06-24 |
| 7368375 | Electronic component with compliant elevations having electrical contact areas and method for producing it | Axel Brintzinger, Stefan Ruckmich | 2008-05-06 |
| 7332430 | Method for improving the mechanical properties of BOC module arrangements | Axel Brintzinger | 2008-02-19 |
| 7271095 | Process for producing metallic interconnects and contact surfaces on electronic components | Axel Brintzinger | 2007-09-18 |
| 7235859 | Arrangement and process for protecting fuses/anti-fuses | Axel Brintzinger, David Wallis, Wolfgang Leiberg | 2007-06-26 |
| 7172966 | Method for fabricating metallic interconnects on electronic components | Axel Brintzinger, Wolfgang Leiberg | 2007-02-06 |
| 7169647 | Connection between a semiconductor chip and an external conductor structure and method for producing it | Ingo Uhlendorf, David Wallis, Axel Brintzinger | 2007-01-30 |
| 7115496 | Method for protecting the redistribution layer on wafers/chips | Axel Brintzinger | 2006-10-03 |