Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8598716 | Semiconductor apparatus having stacked semiconductor components | Harry Hedler, Thorsten Meyer | 2013-12-03 |
| 8124521 | Electrical through contact | Harry Hedler, Volker Lehmann, Thorsten Meyer, Octavio Trovarelli | 2012-02-28 |
| 8106511 | Reduced-stress through-chip feature and method of making the same | Harry Hedler, Rolf Weis, Detlef Weber | 2012-01-31 |
| 8072084 | Integrated circuit, circuit system, and method of manufacturing | Harry Hedler, Stephan Dobritz | 2011-12-06 |
| 8048479 | Method for placing material onto a target board by means of a transfer board | Harry Hedler, Volker Lehmann | 2011-11-01 |
| 8049310 | Semiconductor device with an interconnect element and method for manufacture | Andreas Wolter, Harry Hedler | 2011-11-01 |
| 7960843 | Chip arrangement and method of manufacturing a chip arrangement | Harry Hedler | 2011-06-14 |
| 7847415 | Method for manufacturing a multichip module assembly | Harry Hedler | 2010-12-07 |
| 7834462 | Electric device, stack of electric devices, and method of manufacturing a stack of electric devices | Stephan Dobritz, Christoph Polaczyk | 2010-11-16 |
| 7829380 | Solder pillar bumping and a method of making the same | Harry Hedler | 2010-11-09 |
| 7646090 | Semiconductor module for making electrical contact with a connection device via a rewiring device | Harry Hedler, Thorsten Meyer | 2010-01-12 |
| 7638869 | Semiconductor device | Steve Wood, Hermann Ruckerbauer, Richard Luyken, Carsten Niepelt | 2009-12-29 |
| 7338843 | Method for producing an electronic component, especially a memory chip | Harry Hedler, Barbara Vasquez | 2008-03-04 |
| 7265451 | Semiconductor and method for producing a semiconductor | Harry Hedler | 2007-09-04 |
| 7247948 | Semiconductor device and method for fabricating the semiconductor device | Harry Hedler, Thorsten Meyer | 2007-07-24 |
| 7211472 | Method for producing a multichip module and multichip module | Harry Hedler | 2007-05-01 |
| 7211451 | Process for producing a component module | Thorsten Meyer, Gerd Frankowsky, Harry Hedler, Barbara Vasquez | 2007-05-01 |
| 7087512 | Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions | Harry Hedler, Thorsten Meyer, Barbara Vasquez | 2006-08-08 |
| 7080988 | Flexible contact-connection device | Harry Hedler, Thorsten Meyer, Andreas Wolter | 2006-07-25 |
| 7074649 | Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit | Harry Hedler, Thorsten Meyer | 2006-07-11 |
| 7022549 | Method for connecting an integrated circuit to a substrate and corresponding arrangement | Harry Hedler, Thorsten Meyer | 2006-04-04 |
| 6979591 | Connection of integrated circuits | Harry Hedler, Jens Pohl | 2005-12-27 |
| 6919232 | Process for producing a semiconductor chip | Harry Hedler, Barbara Vasquez | 2005-07-19 |
| 6897088 | Method for connecting circuit devices | Harry Hedler, Jens Pohl | 2005-05-24 |
| 6861291 | Method producing a contact connection between a semiconductor chip and a substrate and the contact connection | Harry Hedler, Barbara Vasquez | 2005-03-01 |