Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10281090 | Lighting device and corresponding manufacturing method | Roberto Didone', Luigi Pezzato, Lorenzo Baldo | 2019-05-07 |
| 10054292 | Lighting device and method of manufacturing it | Marco Munarin, Alberto Alfier, Thomas Rieger | 2018-08-21 |
| 9923129 | Method for producing an LED module and LED module | Simon Schwalenberg | 2018-03-20 |
| 9893230 | Producing a lighting module | — | 2018-02-13 |
| 9696004 | Lighting device and corresponding method | Simon Bobbo, Alberto Alfier, Simone Massaro, Dina Pasqualini, Marco Munarin | 2017-07-04 |
| 9249940 | Lighting device and method for producing a lighting device | Gerhard Holzapfel, Steffen Strauss | 2016-02-02 |
| 7906421 | Method for applying solder to redistribution lines | Octavio Trovarelli, Bernd Zimmermann | 2011-03-15 |
| 7384822 | Package for semiconductor components and method for producing the same | Juergen Zacherl, Stephan Blaszczak, Sylke Ludewig | 2008-06-10 |
| 7368322 | Method for mounting a chip on a base and arrangement produced by this method | Juergen Grafe, Anton Legen, Manuel Carmona | 2008-05-06 |
| 7271484 | Substrate for producing a soldering connection | Carsten Bender, Kerstin Nocke | 2007-09-18 |
| 7256070 | Substrate-based housing component with a semiconductor chip | Anton Legen, Manuel Carmona, Kerstin Nocke | 2007-08-14 |
| 7245013 | Substrate based IC-package | Kerstin Nocke | 2007-07-17 |
| 7229857 | Method for producing a protection for chip edges and system for the protection of chip edges | Juergen Zacherl, Stephan Blaszczak | 2007-06-12 |
| 7223639 | Method of producing an electronic component and a panel with a plurality of electronic components | Stephan Blaszczak | 2007-05-29 |
| 7180162 | Arrangement for reducing stress in substrate-based chip packages | Jens Paul | 2007-02-20 |
| 7036216 | Method and apparatus for connecting at least one chip to an external wiring configuration | Christian Hauser, Johann Winderl | 2006-05-02 |
| 7034383 | Electronic component and panel and method for producing the same | Stephan Blaszczak | 2006-04-25 |
| 7030473 | Substrate-based IC package | Steffen Kroehnert | 2006-04-18 |
| 7008493 | Method for applying a semiconductor chip to a carrier element | Johann Winderl, Christian Hauser | 2006-03-07 |
| 6998296 | Electronic component and method for its production | — | 2006-02-14 |
| 6949820 | Substrate-based chip package | Alfred Haimerl, Steffen Kroehnert | 2005-09-27 |
| 6933595 | Electronic device and leadframe and methods for producing the electronic device and the leadframe | Jürgen Zacherl | 2005-08-23 |
| 6906928 | Electronic component with a semiconductor chip, and method of producing the electronic component | Christian Hauser | 2005-06-14 |
| 6873060 | Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components | Stephan Blaszczak | 2005-03-29 |
| 6664648 | Apparatus for applying a semiconductor chip to a carrier element with a compensating layer | Johann Winderl, Christian Hauser | 2003-12-16 |