Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8957524 | Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure | Dirk Breuer, Frank Kuechenmeister, Kashi Vishwanath Machani | 2015-02-17 |
| 7180162 | Arrangement for reducing stress in substrate-based chip packages | Martin Reiss | 2007-02-20 |
| 6791349 | Electrical component with a contact and method for forming a contact on a semiconductor material | Detlef Nagel, Reinhart Buhr, Hanns-Georg Ochsenkühn | 2004-09-14 |